Technologies – 3D Laser and Volumetric Paste Measurements

MVPs 3D Paste and Laser inspection approach uses patented 3D inspection techniques that allow for highest throughputs, accuracy and repeatability for all application requirements.

The 3D option uses a laser triangulation principle and is based on orthogonal laser sampling with software controlled sampling resolution and angled smart cameras. Capabilities include:

• High Speed Paste Volume Measurements
• Die and surface mapping
• Bond Wire Inspection
• High accuracy, 4um height resolution
• High throughput, 25.6m 3D points per second
• Real-Time SPC
• Warp Compensation
3D

High Speed 3D Paste Measurement and Die Surface Mapping