Semiconductor Packaging Solutions – Paste and Flux Inspection

The 850G 3D Paste capabilities allow for in-line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.

The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

2D 3D Surface

2D Flux Inspection

3D Volumetric Paste Inspection

Surface Topography Measurements

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