MVPs 850G Advanced Packaging Inspection solutions provide class leading capabilities across the complete packaging process.

This modular AOI solution is capable of a range of electro-optic solutions including flying color, UV lighting and true color. Camera FOV’s are scalable to produce a pixel size of 3-25 microns. In addition, a range of flexible material handling solutions, including single and dual lane, are available to process PCB assemblies, JEDEC trays and metal carriers.